Abstract: TiAlN films were deposited by unbalanced magnetron sputtering method on cemented carbide YG6 substrates. Effect of Al target current on the phase, surface topography and micro-hardness was investigated with XRD, SEM, micro-hardness instruments and so on. The XRD patterns of the films confirmed the formation of Ti₃AlN phase and AlN phase, and the coatings showed a fairly strong (220) preferred orientation. The SEM imagines revealed that the grain structure of the films became denser with the increase in Al target current. The average micro-hardness value reached 2 980HV.