1673-159X

CN 51-1686/N

不锈钢/铜基粉末冶金材料载流摩擦耦合温度场模拟

Simulation of Coupled Temperature Field between Stainless Steel and Copper Based Sintered Alloy

  • 摘要: 使用ANSYS有限元软件建立不锈钢/铜基粉末冶金材料在接触电阻热和摩擦热耦合作用下的温度场模型, 给出了两种热量耦合的方法, 计算了模型的温度场, 研究了模型在不同电流和速度条件下的耦合最高温度变化。结果显示: 在相同位移和法向压力条件下, 耦合的最高温度随电流的增大而增大, 随速度的增大而减小。

     

    Abstract: Temperature field model for stainless steel/ copper based sintered alloy under the condition of coupled contact resistor-friction heat was established using finite element software ANSYS.The method for coupling two kinds of heat was given, the temperature field was calculated, and the maximum coupled temperatures changing with different electric currents and velocities were studied.The results show that under the constant displacement and normal force, the maximum coupled temperature increases with the increase in electric current, and decreases with the increase in velocity.

     

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